PI
The Eternal Polymer
Renowned for a continuous service temperature of 300°C, thermal decomposition temperature
above 500°C, ultra-low outgassing in vacuum, and cosmic radiation resistance.
PI is widely honored as the “Soul of Aerospace and Semiconductors.”
300°C
500°C
Cosmic-Grade Durability
No Softening
Non-Flammable
Flexible as Paper
Core Material Advantages
Physical properties designed for extreme industries and deep space environments, defining the performance limits of modern engineering plastics.
300°C
Stable Heat
Maintains excellent mechanical properties and dielectric strength in continuous use environments up to 260°C.
500°C
Non-flammability
The material has no melting point; it only undergoes carbonization in ultra-high temperature environments, with no melting or dripping.
Vacuum &
Low Outgassing
Extremely low vacuum weight loss rate, making it the preferred choice for satellites, optical instruments, and precision semiconductor equipment.
Flexibility & Folding Performance
Capable of withstanding over 100,000 bends; it is the core substrate for foldable phones and FPC (Flexible Printed Circuits).
Radiation
Resistance
Resists impact from high-energy electrons and protons, maintaining over 90% structural integrity in high-radiation environments.
PI Properties and Key Characteristics
| Performance Dimension | Extreme Performance |
|---|---|
| Density | 1.40–1.45 g/cm³ |
| Continuous Service Temp | 300°C (Thermoset), 250°C (Thermoplastic) |
| Thermal Decomposition Temp | >500°C (5% weight loss) |
| Glass Transition Temp (Tg) | >400°C (No Tg for Thermoset) |
| Coefficient of Thermal Expansion (CTE) | 20–40 × 10⁻⁶ /°C (Adjustable) |
| Tensile Strength | 100–350 MPa (Oriented film) |
| Dielectric Strength | 150–300 kV/mm (25μm film) |
| Vacuum Outgassing | TVOC < 10⁻⁶ % (NASA Standard) |
| Radiation Resistance | 10⁹ rad (Electron beam) |
| Flammability | UL94 V-0, LOI >45% |
| Advantages | Disadvantages |
|---|---|
| 300°C long-term service | Extremely high cost (>500 USD/kg) |
| No decomposition at 500°C | High hygroscopicity (requires sealed storage) |
| Space-grade vacuum outgassing | Thermoset - non-recyclable |
| Flexibility + High strength | Processing requires high temp & pressure |
| Radiation + Plasma resistance | Limited color options (Golden/Brown) |
Summary: "PI is the 'thermal guardian' of human technology—from Earth to Mars, it's everywhere!"
| Selection Scenario | Core Value |
|---|---|
| Foldable Screen FPC | Unbroken after 100,000 folds |
| Deep Space Thermal Control | -250°C to +300°C |
| Traction Motors | 300°C Slot Insulation |
| Semiconductor Cleanliness | 10⁻⁹ Level Outgassing |
| Cosmic Radiation | 10⁹ rad No Degradation |
| Material | Cont. Temp (°C) | Decomp. Temp (°C) | Vacuum Outgassing | Flexibility | Cost |
|---|---|---|---|---|---|
| PI | 300 | >500 | ★★★★★ | ★★★★★ | ★★★★★ |
| PEEK | 250 | 580 | ★★★☆☆ | ★★☆☆☆ | ★★★★★ |
| PAI | 260 | 500 | ★★★★☆ | ★☆☆☆☆ | ★★★★★ |
| PEI | 170 | 500 | ★★★☆☆ | ★★☆☆☆ | ★★★★★ |
| FEP | 200 | 400 | ★★★★★ | ★★★★★ | ★★★★☆ |
Application Scenarios
Semiconductors & Mobile Phones
Core flexible printed circuit boards (FPC) inside mobile phones, supporting the precision wiring requirements of 3nm devices.
Spacecraft Multi-Layer Insulation
Golden Kapton film covers satellite surfaces to reflect intense cosmic radiation and maintain stable internal equipment temperatures.
Traction
Motors
Class H insulation for motors and high-performance electric vehicle (EV) drive systems, withstanding high temperatures during overload.
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